• High-speed SMT lines with fine-pitch and micro-BGA placement capabilities.

• Expertise in solder paste inspection (SPI) and reflow processes for complex designs.

• Full traceability and real-time monitoring to ensure assembly accuracy.

• State-of-the-art production lines, including fully automated plating, CNC drilling, and V-CUT machines.

• High-speed laser cutting and grinding machines for precision fabrication.

• Advanced capabilities in ENIG, OSP, and multilayer lamination up to 20+ layers.

• Mastery of controlled impedance and high-aspect-ratio via technologies.

• Green manufacturing with waste reduction and environmental compliance.

• High-precision AOI systems for multilayer PCBs, detecting defects in traces, pads, and solder masks.

• Integrated inspection in multiple stages, ensuring zero-defect products.

• High-precision AOI systems for multilayer PCBs, detecting defects in traces, pads, and solder masks.

• Integrated inspection in multiple stages, ensuring zero-defect products.

• Advanced R&D facilities with CNC machines, laser drilling, and impedance analyzers.

• Expertise in HDI, rigid-flex, and high-frequency PCB design with patented technologies.

• Quick customization and prototyping services for diverse applications.

Engineering Pretreatment Before Production

100% E-test,100% Visual Inspection

AOI Inspection

High Voltage Test;Impedance Control Test

Micro Section,Soldering 

Capacity,Thermal,Shocking Test

Reliability Test,Insulating Resistance 

Test,Ionic Cleaning Test Etc.,